Power_electronics Features

NewSpace demands low voltage, high current power for performance and longevity - Nov 2022
Matt Renola, Senior Director, Global Business Development – Aerospace & Defense
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Power Electronics Europe News
SMD thermal jumper chip increases power handling capability

The Vishay Dale thin film chip removes heat from electrically isolated components reduce component temperature by over 25%, with a thermal conductive pathway to a ground plane or common heatsink. 

It is based on an aluminium nitride substrate with high 170W/m°K thermal conductivity. Reducing the temperature of connected components allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved, the company adds.

The THJP's capacitance is down to 0.07pF, suitable for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters, RF amplifiers, synthesisers, pin and laser diodes and filters for industrial and telecommunications applications.

The device is available in six case sizes from 0603, 0612, 0805, 1206, 1225 and 2512, with custom sizes also available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.

Samples and production quantities of the ThermaWick THJP series thermal jumper are available now, with lead times of six weeks.


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