Featured Articles

Knightscope’s autonomous security robots patrol with superhuman acuity and detection prowess - May 2023
A fusion of innovative robotics, self-driving technology, vehicle electrification and artificial intelligence
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
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Power Electronics Europe is the premier publication devoted entirely to the field of power electronics. The journal covers all that is new in power electronics including emerging technologies and the application of advanced components, sub-assemblies, systems and solutions.
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Latest Features
The Pressure is On - May 2023
John Govier, Sales Director of Inseto, summarises how far sintering has come and hints at what’s in store...
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A high efficiency, 3 kW capable, 2-phase, 3-level Converter using paralleled eGaN® FETs - May 2023
As the revolution of renewable energy as well as transportation electrification progresses, the need for residential energy storage systems is increasing. A high efficiency DC-to-DC converter is usually required to exchange energy generated from renewable sources, such as solar panels, with a battery...
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eGaN FETs enable more than 4 kW/in3 power density for 48 V to 12 V power conversion - March 2023
GaN transistors in Chip Scale Package (CSP) enable higher than 4 kW/in3 power density for 48V to 12V power conversion using an LLC resonant converter with up to 1 kW capability.
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Wolfspeed grows to meet supply challenge and launches high performance Gen 3+ die - March 2023
Silicon Carbide (SiC), known for long as the ideal semiconductor technology for power devices, has with design and manufacturing innovation not only increased its share of the existing market but enabled new applications, such as electric vehicles (EVs), by offering higher power density, better high-speed switching performance, higher breakdown field, higher thermal conductivity, higher chip temperatures and lower leakage currents than are possible with Silicon (Si).
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