Tonghui Introduces Techmize Brand
12 August 2026 Tonghui (Changzhou), a manufacturer of advanced test and measurement solutions for component parameters, power electronics, electrical safety, and cable testing, has announced it is… Read More
09 Oct 2026
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THE EUROPEAN JOURNAL FOR POWER ELECTRONICS AND TECHNOLOGY
News
12 August 2026 
Power Integrations Demonstrates 2200 V GaN Technology
7 August 2026 Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, has announced that PowiGaN gallium-nitride (GaN) technology is now rated at up… Read More
Current Sense Resistors for Automotive and High-Reliability Applications
5 August 2026 Bourns has announced the CFG-A Series Wide-Terminal Metal Foil Current Sense Resistors, available in 0508 and 0612 footprints. The company says… Read More
Multi-Constellation GNSS Positioning, Navigation, and Tracking Click from MIKROE
5 August 2026 Through a partnership with Swift Navigation, a leader in precise positioning technology, MIKROE, an embedded solutions company that can cut development time by providing… Read More
Hirose Launches Hybrid FPC-to-Board Connector with Fully Shielded Structure for Superior EMI Prevention
5 August 2026 Hirose has announced it has launched a hybrid FPC-to-board connector with a fully shielded design that blocks both radiation and incident magnetic fields for… Read More
ScanReach Strengthens Offshore Wind Industry Voice
31 July 2026 ScanReach has announced it is set to play an even greater role in supporting the future of the UK’s renewable… Read More
Mocean Energy Targets Growing AI Data Centre Market
31 July 2026 Mocean Energy has announced it has entered the AI infrastructure market with Blue Core, an offshore data centre concept designed to generate its own… Read More
Enabling Technologies for Next-Generation Electronics – Comprehensive MLCC Portfolio From the YAGEO Group
31 July 2026 As electronic systems deliver greater functionality within increasingly compact form factors, the demands placed on passive components are changing fundamentally. Multilayer ceramic capacitors (MLCCs)… Read More
Stackpole’s RMCA Automotive Grade Chip Resistors Deliver Higher Power Density for Space-Constrained Designs
29 July 2026 Stackpole Electronics has announced it has expanded design flexibility for automotive and other high-reliability electronics with its RMCA Series automotive grade chip resistors, now… Read More
Bourns Introduces LTCC Diplexer for Dual-Band GNSS L-Band Signal Processing in Compact RF Front Ends
29 July 2026 Bourns has announced the Model FDP2009N122157H4 , its LTCC diplexer designed for RF front-end integration in GNSS L-band applications where signal isolation,… Read More