Alpha and Omega Semiconductor Unveils AmpStack Packaging: A Leap Forward in MOSFET Power Density
Innovative vertically stacked packaging DFN6x5 technology in a half-bridge configuration Read More
Innovative vertically stacked packaging DFN6x5 technology in a half-bridge configuration Read More
New 1,800V and 3,300V G3VH devices drive efficient, lightweight electrification Read More
This verification was conducted using Anritsuâs 5G NR Mobile Device Test Platform ME7834NR Read More
The companys says the series combines up to ±30 kV ESD protection Read More
Designed for wallbox applications and already meeting upcoming European short-circuit requirements Read More
Featuring an Arm Cortex M4 core to support small scale system control of consumer products and industrial equipment Read More
This collaboration strengthens the long-standing partnership between Advantech and Intel Read More
The HM216xNL series from YAGEO Group combines high isolation capability and automotive qualification Read More
The new product enables automated mounting while achieving comparable heat dissipation performance Read More
New user-friendly online product selector and configuration tool Read More