Power Packaging Features

Features

MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Packaging Features

A new standard in dual power MOSFET packaging - issue 3/2014	May, 29 2014
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
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New Thermal Design Options Drives Power Density - issue 7/2013	November, 04 2013
With every generation, electronic products shrink while functionality expands and performance improves. Despite efforts to hold the line on product power dissipation, pressure to increase power density in energy-management subsystems continues unabated....
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