Power Packaging Features

Features

Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
More details...

RSS News feeds

AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...

Power Packaging Features

A new standard in dual power MOSFET packaging - issue 3/2014	May, 29 2014
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
View PDF

New Thermal Design Options Drives Power Density - issue 7/2013	November, 04 2013
With every generation, electronic products shrink while functionality expands and performance improves. Despite efforts to hold the line on product power dissipation, pressure to increase power density in energy-management subsystems continues unabated....
View PDF

Go Back