iPower 2013 – Building A Smart Power Future
The conference will cover a
pplications, trends and emerging markets; packaging, test and reliability; assembly materials and technologies; devices and integrated processes (micro-machining, micro-moulding); thermal management and efficiency; product design development and modelling; interconnection, integration and systems; solutions for harsh environments; high reliability and temperature, design and future concepts.The schedule of 16 technical presentations provides opportunities for networking and time to review the poster displays and booths from exhibiting companies.