MH3261 T Series High Current Chip Ferrite Beads for EMI Suppression in High Density Power
3 June 2026 Bourns has announced the MH3261âT Series High Current Chip Ferrite Beads, designed to address EMI suppression challenges in highâdensity PCB layouts where current capacity and board space are constrained.
The company says the series combines a compact 3.2 × 1.6 mm footprint with low DC resistance and rated current capability up to 11 A, enabling noise suppression without introducing excessive power loss. These characteristics support stable performance in spaceâlimited designs.
As power densities increase and PCB assemblies become more compact, designers face tighter limits on allowable insertion loss while maintaining effective highâfrequency noise suppression. Ferrite beads used in these environments must carry higher currents without thermal overstress or impedance degradation. The MH3261âT Series addresses these constraints by pairing low DCR with a wide impedance range, supporting EMI control in dense layouts while operating across a broad temperature range from –55 °C to +125 °C.
Edward Liu, Director of Magnetic Components at Bourns says: “High-density power require ferrite beads that can carry substantial current without compromising impedance or thermal margin,” said Edward Liu, Product Line Manager, Component Magnetics, Bourns. “The MH3261âT Series was developed to provide low DC resistance and rated current up to 11 A in a compact footprint, helping designers manage EMI in constrained layouts while maintaining operating stability over the full –55 °C to +125 °C temperature range.”