MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The TO-Leadless package in combination with 40V shield-gate technology (SGT) is claimed to provide the highest current capability in its voltage class. The TOLL package has the highest current capacity says the company, employing technology which uses a clip to achieve the 400A DC at 25°C capability.
The TOLL packaging offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.
The AOTL66401 (40V) has a 30% smaller footprint compared to a TO-263 (D2PAK) package, and its higher current carry capability that enables the designer to reduce the number of devices in parallel. The device offers a higher power density and can be used for industrial BLDC motor applications and battery management to reduce the number of MOSFETs.
The AOTL66401 has a 0.7mΩ max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature. The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.
The AOTL66401 is immediately available in production quantities.
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