Features
Power_electronics Features

BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
More details...
AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
Power Electronics Europe News
 
IPMs for low-medium drives are based on RCD2 IGBT technology
The efficient IPMs (intelligent power modules) are based on the new 600V Reverse Conducting Drive 2 (RCD2) IGBT technology and have an open emitter. The CIPOS IM523 series enables designers to integrate power and control components to increase reliability and optimise PCB size and system cost, says Infineon. The IPMs are designed to control three-phase motors in low- and medium-power variable-speed drives used in home appliances, HVAC, industrial fans and drives up to 1.4kW.

The RCD2 IGBTs are combined with an SoI (silicon-on-insulator) gate driver to lower system power dissipation. The three-phase inverter configurations with open emitters are integrated in a DIP 36 x 21mm package which has been specially adapted to power applications which need good thermal conduction and electrical isolation. The series is claimed to exhibit best-in-class switching loss and deliver “excellent” energy efficiency especially in applications with high switching frequency.

The devices are available in current ratings from 6.0 to 17A, with a breakdown voltage of 600V. A built-in, UL-certified NTC thermistor for temperature monitoring, undervoltage lockout (UVLO) at all channels and overcurrent protection are also included to enhance the system reliability.

Package and mould compound offer improved humidity robustness while an integrated bootstrap circuit simplifies the PCB layout.

The industry-standard package allows for easy and fast design conversion of existing Mini IPMs (P2P) without PCB redesign, to shorten time-to-market, adds the company.

Volume production of the CIPOS Mini IM523 series was started and the devices are available for order now.

 

 




View PDF
 
Go Back   
Newsletter sign up

Sponsors