PAN B511-1x from Panasonic in three versions: Next Gen-module for innovative Bluetooth 6 applicationsâ at Rutronik
20 February 2025 Rutronik has announced it is expanding its wireless portfolio to include the next generation PAN B511-1x Bluetooth 6module from Panasonic.
The company says the LE (Low Energy) module is based on the ultra-low-power wireless SoC nRF54L15 from Nordic and combines its most important functions for increased performance and memory with minimal energy consumption. This makes the component particularly suitable for use in battery-powered applications. With its small form factor, hybrid castellated holes, LGA footprint design, the module enables optical output inspections, 2-layer designs and fast prototyping via hand soldering. The module is available soon in “Economy”, “Standard” and “Premium” versions.
Panasonic’s PAN B511-1x module features an integrated 128 MHz Arm Cortex-M33 processor, 5 MB NVM (non-volatile memory) and 256 kB RAM. With a maximum transmission power of up to 8 dBm and a typical reception sensitivity of -98 dBm (at 1 Mb / s) and -106 dBm (at 125 kb / s in LE mode Long Range), the module is able to receive even very low signals at a wider range. The component works reliably in a temperature range of -40 °C to 85 °C at a voltage range of 1.7 V to 3.6 V and has additional GPIO interfaces on the underside.
The module is available in three versions:
Economy: Bluetooth 6 & 802.15.4 module based on nRF54L15, with integrated chip antenna for use in applications such as • Smart Lighting • White Goods • Industrial sensors
Standard: Bluetooth 6 & 802.15.4 module based on nRF54L15, with integrated chip antenna for use in applications such as • Medical devices • Wearables • Energy management
Premium: Bluetooth 6 & 802.15.4 module based on the nRF54L15 with integrated chip antenna, integrated slow clock and additional 4 MB flash memory for use in applications such as • Machine learning • Matter applications