Texas Instruments to Showcase New Automotive, Industrial and Data Centre Innovations at PCIM 2026
13 May 2026 At PCIM 2026, June 9-11 in Nuremberg, Germany, Texas Instruments (TI) says it will exhibit how semiconductor innovation is helping today’s engineers maximise efficiency, push more power into smaller spaces and support higher voltages. The company says its display in hall 7, booth 652, will demonstrate how TI is innovating what’s next in power.
- Develop electric vehicles that are safer, smarter and more efficient: TI says it is pioneering new advancements in battery health monitoring to unlock longer battery life, enhance safety and prevent critical failures through technologies spanning predictive battery management, single-stage power conversion and 48V architectures. These new solutions can help accelerate EV development and bring next-generation vehicles to market sooner.
- Optimise the grid with more intelligent electrification: TI’s GaN and SiC wide-bandgap technologies can deliver the high efficiency and power density engineers need for bi-directional inverters, intelligent energy storage, and megawatt-scale EV charging. Paired with edge AI for real-time, low-overhead control, TI\’s solutions help engineers optimise the grid.
- Build next-generation AI data centres: TI says it is transforming the power path from grid to gate through innovative products and designs that support 800 VDC architectures while maximising power density and conversion efficiency. These technologies enable the massive computational power demands of tomorrow\’s AI workloads while ensuring scalable and reliable AI data centre operations.