Two MOSFET package options provide large insulation path lengths
11 March 2014 The PowerFLAT 5×6 HV and PowerFLAT 5×6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650 V or 800 V, within the same 5 x 6 mm footprint of a standard 100 V PowerFLAT 5×6. This is 52 % smaller than the popular DPAK footprint, says the company. In addition, the package is only 1 mm high and features a large exposed metal drain pad that maximizes heat dissipation into PCB thermal vias.
This combination of features simultaneously increases high-voltage capability, ruggedness, reliability, and system power density. In addition, ST has started sampling two new 600 V fast-switching MDmesh II Plus low gate charge MOSFETs in PowerFLAT 5×6 HV.