| The Pressure is On - May 2023 |
May, 02 2023 |
| John Govier, Sales Director of Inseto, summarises how far sintering has come and hints at what’s in store... |
|
View PDF
|
|
|
| NewSpace demands low voltage, high current power for performance and longevity - Nov 2022 |
November, 07 2022 |
| Matt Renola, Senior Director, Global Business Development – Aerospace & Defense |
|
View PDF
|
|
|
| Maximizing Active Front End Efficiency Using Silicon Carbide - March 2022 |
March, 02 2022 |
| Engineers designing UPS with great care to ensure smooth enterprise data center operation 24/7 are also aware that their power supplies are destined to be part of a setup that gulps for example 90 TWh of US electricity every year — enough to sustain thirty large and noxious coal-fired plants. Power engineers in
another design camp, working to ensure their fast chargers can speedily top up EVs, are also aware of the cost of electricity and the environmental impact of its generation.. |
|
View PDF
|
|
|
| Innovating Power Module Packaging - May 21 |
April, 22 2021 |
| A system’s power delivery network or PDN is made up of passive and active components such as cables, connectors, AC-DC and DC-DC converters and regulators. As power levels increase to enable new
features and the electrification of mechanical and hydraulic systems, PDN performance is becoming more critical, and in some cases, constraining end system capabilities because of PDN footprint, weight and power losses. |
|
View PDF
|
|
|
| Power of the Module - Nov/Dec 2020 |
November, 20 2020 |
| Vicor has established a power module capability spanning product design, manufacturing, simulation and selection tools. This capability allows Vicor to enable power systems designers to quickly and easily deploy high-performance power delivery networks (PDNs), from the power source to the point-of-load (PoL) for end systems extending across many different industries such as (automotive, AI/data center, defense and aerospace, LED lighting, etc.) |
|
View PDF
|
|
|
| Direct Cooled Low Inductive SiC Mold Module - issue 3/2019 |
June, 26 2019 |
| To make use of the superior properties of wide bandgap (WBG) semiconductors, power modules are needed with optimised parasitic electromagnetic properties, a high temperature capability and the possibility for a high degree of integration... |
|
View PDF
|
|
|
| DC Bus switching performance as determined by commutation loop parasitics and switching dynamics - issue 3/2018 |
May, 17 2018 |
| In this article a 250KW all-SiC inverter evaluation kit designed around low-inductance, high speed power modules is used to demonstrate the DC Bus switching performance resulting from the interaction among commutation loop parasitics and the switching dynamics.. |
|
View PDF
|
|
|
| Tailoring Circuit materials for power electronic applications - issue 2/2017 |
April, 28 2017 |
| As electronic devices continue to shrink in size as they grow in power, demand grows for power electronic circuits with increased power density... |
|
View PDF
|
|
|
| High -Tempeature TIMs for power modules and devices - issue 2/2017 |
April, 28 2017 |
| The proliferation of the usage of power modules has driven the industry to push for higher and more demanding modules. this increase in performance is typically accompanied by higher power densities... |
|
View PDF
|
|
|
| Fast heat distribution simulation and visualization - issue 2/2017 |
April, 28 2017 |
| A commonly used simulation method for heat distribution within the power module is the 3D FEM analysis..... |
|
View PDF
|
|
|
| High-Voltage SiC Power Modules for 10-25KV Applications - issue 1/2016 |
March, 20 2016 |
| The development of power electronic devices with higher operating voltages (6.% kV+) has enabled more power to be transmitted for a given current and reduced the number of switches required to reach those voltage levels in multi-level converters... |
|
View PDF
|
|
|
| Novel Low Inductive Phase-Leg IGBT Module Eases Paralleling - 4/2015 |
July, 15 2015 |
| ABB has introduced the LinPak, a new open standard phase-leg type IGBT power module with a rating of 1700V and 2 x 1000A and a footprint of 100mm x 140mm. this type of module will set a new standard in power density... |
|
View PDF
|
|
|
| Gallium nitride Transistors drive automotive applications - issue 3/2015 |
June, 11 2015 |
| Enhancement-mode gallium nitride transistors have been in production for over 5 years. As the technology has matured it has been adopted into a number of automotive applications such as cockpit wireless charging, LiDAR sensing.... |
|
View PDF
|
|
|
| GaN FET Module performance advantage over silicon - issue 3/2015 |
June, 04 2015 |
| Gallium Nitride (GaN) FETs are increasingly finding use as next generation, high-power devices for power electronics systems..... |
|
View PDF
|
|
|
| Through system thinking designing reliable high-power IGBT modules - issue 2/2015 |
March, 11 2015 |
| Infineon has a long history of setting international standards for IGBT modules. System thinking is one of the biggest drivers in search for new technologies... |
|
View PDF
|
|
|
| Power Modules to the Rescue - issue 8/2014 |
December, 15 2014 |
| There are an increasing number of suppliers offering power modules due to improvement in technology on many fronts..... |
|
View PDF
|
|
|
| Fine tuning of digital control in POL regulators optimize dynamic response and minimize component count - issue 1/2014 |
February, 10 2014 |
| Power system design encompasses many requirements and criteria. This article is about perhaps the most basic of all requirements - a stable voltage supply of the operating circuitry... |
|
View PDF
|
|
|
| Optimized Design for vibration resistant power module package - issue 8/2013 |
December, 24 2013 |
| IGBT based power modules designed for typical industrial applications cannot be transferred to commercial, agriculture and construction vehicles (CAV) applications without changes... |
|
View PDF
|
|
|
| High Frequency Oscillations due to Driver Coupling - issue 6/2013 |
October, 02 2013 |
| The coupling between the driver and the power module is usually given too little attention. Yet, many problems can be tracked back to this interface, such as when IGBTs are switched very rapidly, or when desaturation takes place during short circuits... |
|
View PDF
|
|
|
| Improved HiPak Modules for Power Electronic Applications - issue 5/2013 |
August, 26 2013 |
| Today, IGBT based power electronics modules are the devices of choice for a vast range of applications from light-rail vehicles, heavy duty multi megawatts locomotives to hundred megawatts HVDC installations... |
|
View PDF
|
|
|
| Silicon Carbide Boost Power Module Performance - issue 4/2013 |
June, 20 2013 |
| Silicon Carbide offers new approaches for the design of power semiconductors. In conventional power Silicon technology, IGBTs are used as switches for voltages higher than 600V and Silicon PIN freewheeling diodes are state of the art.... |
|
View PDF
|
|
|
| Considerations for developing custom power module solutions - issue 2/2013 |
April, 02 2013 |
| In the last years the power module market demand changed quickly due to the stringent power design constraints of cost saving and efficiency increase. R&D engineers are working for innovative solutions where high integration level and latest chip technologies are the driving factors in the design phase... |
|
View PDF
|
|
|
| Sugar-Coated Power Cycling Lifetime - issue 7/2012 |
November, 30 2012 |
| Power cycling is an important method to characterise the lifetime of power semiconductor modules. application engineers use lifetime curves published by manufacturers to verify that their system design meets the required reliability..... |
|
View PDF
|
|
|
| Hybrid SiC Power Modules with Low Power Loss - issue 6/2012 |
October, 10 2012 |
| Mitsubishi Electric has developed a 1.7V hybrid power module consisting of 6th generation Si-IGBT and SiC schottky Barrier Diode (SBD). Adopting SiC-SBD enables a significant power loss reduction during the diode turn-off and IGBT turn-on. |
|
View PDF
|
|
|
| Asymetrical Parasitic Inductance Utilsed for switching loss reduction - 5/2012 |
September, 25 2012 |
| High efficiency of power conversion circuits is a design goal on its own. the reduction of switching losses is the basis for higher switching frequencies which lead to a reduction of the size and weight of the passive components...5/2012 |
|
View PDF
|
|
|
| Extension of Operation Temperature Range to 200ºC Enabled by Al/Cu Wire Bonds 4/2012 |
July, 12 2012 |
| Device manufacturers have announced the extension of the maximum junction temperature to 200ºC in the next generation of IGBTs. However, this extended temperature range can only be utilized when accompanied by a significant enhancement of the package reliability. Al-clad Cu wire bonds together with Ag sinter technology have the potential to achieve this goal. |
|
View PDF
|
|
|
| IGBT Press-Packs for the Industrial Market - issue 7/2011 |
January, 26 2012 |
| The standard Press-pack IGBT (PPI) basically uses the same packaging concept as Bipolar high power semiconductor devices. The main difference is that the high power semiconductor content in the package is sqaure IGBT chips arranged on a round molybdenum disc instead of large, round bipolar devices matched in size to the molybdenum disc and ceramic housing. |
|
View PDF
|
|
|
| A 6in 1 IGBT Module Performance Evaluation Platform - issue 8/2011 |
January, 26 2012 |
| Achieving good loss performance by high switching speed at low gate resistance is trading-off with the system's EMI behaviour. An evaluation platform has been developed to characterize 6in 1 IGBT modules and to determine their dv/dt versus turn-on loss as function of the gate resistance. A chart indicating the trade-off between turn-on switching loss versus dv/dt parameterized as a function of the sum of internal and external gate resistance of a 150A/1200V 6in 1 IGBT module will be presented. |
|
View PDF
|
|
|
| Reliable and cost effective solution without baseplate - issue 6/2011 |
October, 01 2011 |
| Power modules are used for a wide range of different applications. For some applications the power density, the efficiency or the price is one of the key factors.... |
|
View PDF
|
|
|
| Counting methods for limetime calculation of power modules - issue 6/2011 |
October, 01 2011 |
| Various counting methods are applied to extract amplitude and number of thermal cycles from a mission profile.... |
|
View PDF
|
|
|
| Power Electronics packaging revolution without bond wires, solder and thermal paste - issue 5/2011 |
August, 20 2011 |
| Power module packaging is driven by the ever increasing demand for higher power densities, reliability improvments and further cost reductions. The known reliability limitations of traditional solder joints and bond wires are holding back significant power density increases...... |
|
View PDF
|
|
|
| EconoPACK+ D-Series with Enhanced characteristics - issue 5/2011 |
August, 19 2011 |
| The EconPACKTM+ is an innovative IGBT power module concept for very compact and high efficiency inverter designs with power ratings higher than 100KW. This power module concept was developed first by Infineon at the end of the 90s..... |
|
View PDF
|
|
|
| Fast switching 1200V normally-off SiC VJFET power modules - issue 8/2010 |
December, 20 2010 |
| An all SiC based power module for use in high frequency and high efficiency applications has been developed. Using parallel combinations of 1200V enhancement mode SiC VJFETs and Schottkydiodes, a total on-resistance of only 10m OHM was achieved at 100A drain current in a commercially available standard module configured as a half-bridge circuit.... |
|
View PDF
|
|
|
| Power module with additional low inductive current path - issue 7/2010 |
November, 17 2010 |
| Parasitic inductances are a major problem with power modules, inparticular in fast switching applications. The parasitic inductance of the component inteconnections causes an over-voltage condition and increases the swith-off losses in the semiconductor...... |
|
View PDF
|
|
|
| Wide Temperature Operating range of high isolation HV-IGBT modules |
November, 16 2010 |
| Mitsubishi Electric has developed new high range insulated gate bipolar transistor (HV-IGBT) modules called the 'R-Series' with a high isolation package, which can beused with a wide operating temperature range from -50 degrees C up to 150 degrees C..... |
|
View PDF
|
|
|
| Next Generation High Peformance BIGT HiPaK Modules - issue 5/2010 |
September, 01 2010 |
| The practical realization of the Bimode Insulated Gate Transistor (BIGT) will provide a potential solution for furutre high voltage applications demanding compact systems with hgher power levels. In this article, we give an outlook into the new technology and the basic performance levels which could be acchieved as the BIGT progresses towards the product develoment stage.... |
|
View PDF
|
|
|
| Power Modules for Motor Control Applications - issue 5/2010 |
September, 01 2010 |
| For applications in power electronics where significant power needs to be handled in confined spaces, often the choice for packaging is not a set of discrete power components, but a dedicated power module. For that purpose CoolPAK realises an insert-molded shell which has an integrated metal lead-frame array. These lead-frames also present horizontal areas for housing bare die components as well as forming out the terminals for the outside contacts... |
|
View PDF
|
|
|
| High Voltage Phase-leg modules for medium voltage drives and inverters |
May, 18 2010 |
| Medium voltage inverters (line voltages of 1000-3300V) or auxilliary inverters for rail applications at rather low power levels of 100 to 1000 kW suffered by the lack of availability of suitable high voltage IGBT modules rated at lower current. Thus inverter manufacturers had to use odules with too high current ratings which yielded in bulky inverter designs..... |
|
View PDF
|
|
|
| Thermal behavious of three level trench gate IGBT modules in PFC and PV operation - issue 1/2010 |
March, 25 2010 |
| The control of the power semiconductors in a three-level NPC topology employs a set of 12 control signals in total. A back-to-back teo level/three level inverter has been built to circulate power performing arbitrary load conditions to analyse the thermal dissipation of the power semiconductors.... |
|
View PDF
|
|
|
| Comprehensive testing with combination testers |
December, 14 2009 |
| Increasing qulaity demands requiring 100% testing of semiconductors. Static tests are no longer enough. Only supplemental dynamic testing procdures such as swithcing unclamped inductive load and a double impulse test can meet the requirements. Inspection of thermal impedance is very important in the process. The simplest approach uses a test system that can perform all these tests. ISSUE 8/2009 |
|
View PDF
|
|
|
| Advantages of Advanced Active Clamping |
December, 14 2009 |
| Power Semiconductor manufacturers are offering IGBT modules with ever greater power densities. The limit is represented by the maximum power loss that can be dissipated; optimisation criteria are the packaging technology as well as the conduction and switching losses of the semicoductor chips. ISSUE 8/2009 |
|
View PDF
|
|
|
| Parameter Sensing in Power Electronic Modules |
October, 19 2009 |
| Modern inverter applications and electrical drive control algorithms depend on accurate measurements regarding key parameters. For the application and the inverter two parameters are of special interest. The line current driving the application and the power module’s temperature provide the necessary information on the state of operation. New power modules like Infineon’s MIPAQ family integrate proper sensors, as well as adapted electronics, to provide highly accurate readings and ease the desig |
|
View PDF
|
|
|
| Efficiency Improvement with Silicon Carbide Based Power Modules |
September, 15 2009 |
| Whereas SiC switches have the overall lowest dynamic losses, they show higher static losses due to the lack of conductivity modulation and the necessary chip size limitations due to the still high SiC base material price. |
|
View PDF
|
|
|
| Sinter Technology for Power Modules |
May, 01 2009 |
| High-power applications such as automotive, wind, solar and standard industrial drives require power modules which fulfil the demand for high reliability, thermal and electrical ruggedness. |
|
View PDF
|
|
|
| Investigations on Ageing of IGBTs Under Repetitive Short-Circuit Operations |
May, 19 2008 |
| Power Modules - Investigations on Ageing of IGBTs Under Repetitive Short-Circuit Operations. Issue 5 2008 |
|
View PDF
|
|
|
| Power Cycling Induced Failure Mechanisms in High Temperature Applications |
April, 15 2008 |
| Power Module Reliability - Power Cycling Induced Failure Mechanisms in High Temperature Applications. Issue 4 2008 |
|
View PDF
|
|
|
| Paralleling of IGBTs and Diodes of One Power Module |
April, 10 2008 |
| Power Module Paralleling - Paralleling of IGBTs and Diodes of One Power Module - Pushes Power Capability. Issue 4 2008 |
|
View PDF
|
|
|
| Power Device Technologies for Sustainable Growth of Power Conversion Applications |
April, 02 2008 |
| Power Modules - Power Device Technologies for Sustainable Growth of Power Conversion Applications. Issue 4 2008 |
|
View PDF
|
|
|
| New Intelligent Power Module Series. |
February, 29 2008 |
| Power Modules - New Intelligent Power Module Series.
Issue 2 2008
|
|
View PDF
|
|
|
| Passive Components |
January, 22 2008 |
| Passive Components-Application Based Resistor Selection Criteria Issue 1 2008 |
|
View PDF
|
|
|
| Low EMI Techniques for New Generation IGBT Modules |
January, 14 2008 |
| Power modules - Low EMI Techniques for New Generation IGBT Modules Issue 1 2008 |
|
View PDF
|
|
|
| Hermetic Packaging for Multichip Modules |
July, 12 2007 |
| Power Modules - Hermetic Packaging for Multichip Modules. Issue 7 2007 |
|
View PDF
|
|
|
| Pressure Sintering for Power Modules. |
July, 06 2007 |
| Power Modules - Pressure Sintering for Power Modules. Issue 7 2007 |
|
View PDF
|
|
|
| Press FIT for Solderless Assembly of Power Modules |
May, 18 2007 |
| Power Modules - Press FIT for Solderless Assembly of Power Modules. Issue 5 2007 |
|
View PDF
|
|
|
| Sensor Applications in Power Modules |
May, 03 2007 |
| Power Modules - Sensor Applications in Power Modules. Issue 5 2007 |
|
View PDF
|
|
|
| New 4500V SPT+ HiPak Modules |
April, 26 2007 |
| Power Modules - New 4500V SPT+ HiPak Modules. Issue 4 2007 |
|
View PDF
|
|
|
| New 2-Pack IGBT Module with Spring Contacts |
March, 12 2007 |
| Power Modules - New 2-Pack IGBT Module with Spring Contacts. Issue 3 2007 |
|
View PDF
|
|
|
| Voltage Insulation Power Modules |
March, 08 2007 |
| Power Modules-High - Voltage Insulation Power Modules - System Design and Qualification. Issue 3 2007 |
|
View PDF
|
|
|
| Advanced Power Modules for Telecom Applications Issue 2 2007 |
February, 19 2007 |
| Power management - Advanced Power Modules for Telecom Applications Issue 2 2007 |
|
View PDF
|
|
|
| Flexible One-Step Mounting Technology Issue 2/2012 |
|
| Aiming to cut assembly costs and avert inverter assembly flaws, several companies now offer power
modules that can be mounted in a single step. Vincotech taken this notion and developed a novel Press-fit
technology and made it available in a wide range of products, including modules with pre-applied phase
change material and thermal grease. These power modules also enable low inductance designs. |
|
View PDF
|
|
|
| With Sinter-Technology Forward to Higher Reliability of Power Modules for Automotive Applications Issue 2/2012 |
|
| A new kind of applications, the whole automotive market describes more and more a “high end”-power
module. The unprecedented combinations of thermal, electrical, and reliability performance with a very
small volume and weight are the challenge today. A consistent further development of sinter technology for
power modules comprises and answers to all these requirements. Sinter technology substitute all solder
connections and also the aluminum bond wires. |
|
View PDF
|
|
|
| A Technology Platform for Advanced Power Electronic Systems 3/2012 |
|
| The SKiN technology eliminates the weaknesses of the classical module design and introduces an
integrated platform architecture for the design of compact and reliable power electronic systems.
Uwe Scheuermann, Product Reliability Manager, SEMIKRON Elektronik, Nuremberg, Germany.
The limits in lifetime of classical power modules have been investigated and discussed extensively during the last decades. |
|
View PDF
|
|
|
