Power_electronics Features

Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Feature Spotlight
Finding the Right Technology to Solve Datacenter Power Challenges - Nov/Dec 2022
   November 7, 2022
Although Silicon (Si) is the most familiar technology, its smaller bandgap limits operating temperature, its low breakdown electric field restricts its use to lower voltages, and its low thermal conductivity limits power density compared to wide bandgap (WBG) materials, like gallium nitride (GaN) and Silicon Carbide (SiC).
Digitization and the rapid deployment of cloud services have boosted the growth of datacenters worldwide. WBG helps to reduce their power consumption.
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