The PowerFLAT 5x6 HV and PowerFLAT 5x6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650 V or 800 V, within the same 5 x 6 mm footprint of a standard 100 V PowerFLAT 5x6. This is 52 % smaller than the popular DPAK footprint, says the company. In addition, the package is only 1 mm high and features a large exposed metal drain pad that maximizes heat dissipation into PCB thermal vias. This combination of features simultaneously increases high-voltage capability, ruggedness, reliability, and system power density. In addition, ST has started sampling two new 600 V fast-switching MDmesh II Plus low gate charge MOSFETs in PowerFLAT 5x6 HV.

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