The Empower IVR EP7010 is a 10A Regulator that can regulate through a load step from zero to 10 A in 500 ns with <15 mV droop, without output capacitors.

The patented digitally configurable hardware platform has simplified the adoption of DC/DC converters for designers. By having multiple entire power supplies in a single IC package, the usual concerns of component variation and sourcing, synchronization and stability are all either eliminated or reduced significantly.

The EP70xx achieved the total integration of a triple output DC/DC power supply with no external components into a single tiny 5 mm x 5 mm package. “Fast start-up times can be critical in many applications and being able to offer the world’s fastest transient response times is critical to many customers. With this game-changing speed improving both energy efficiency and performance is having a tremendous impact,” said Steve Shultis, Senior Vice President WW Sales and Marketing at Empower Semiconductor. “We have achieved incredible results in our EP70XX product family that has now delivered the world’s fastest transient speeds from zero to 10A in 500ns with <15mv droop without any output capacitors. This combination of density, speed and efficiency are allowing designers to utilize our products in groundbreaking ways, enabling breakthrough levels of system performance.”

The EP70xx family displays peak efficiencies of up to 92 % with a nearly flat efficiency curve up through 10 A of output current due to its unique architecture. The devices showcase 1,000x faster dynamic voltage scaling than competing products, enabling fast and lossless processor state changes that can save 30 % or more of processor power. EP70xx family is available with nine devices to choose from with up to three regulators per device. Outputs are available from 2 A to 10 A in a 5x5 mm or 4x4 mm package with a 0.75 mm profile, which is 3-5x thinner than traditional integrated power modules and inductors. The products achieve a level of density and simplicity so high that they are also available in bumped die form for co-packaging with digital ICs, enabling full power management integration into an SoC. AS

https://www.empowersemi.com/product-page-ivr/