Features
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AC/DC power factor correction module offers up to 1,512W
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
PCIM Europe 2021 � a digital event for the industry
As was the case last year, the exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management will not take place in its usual venue but online. Visitors can access exhibitors and speakers to network and exchange views on product innovations. They can also learn about the latest research findings and technology innovations.
There is a full and comprehensive conference and seminar programme, with an additional impulse presentation on “The Future of Work” and participant-driven “Jump-In Discussions”. In the latter, the audience can actively participate and shape the content of the session. Taking part in the digital exhibition area is free of charge for users.
A key part of the event is the conference and seminar programme, which this year has over 250 presentations.
A major part of the conference is dedicated to key innovations in the field of power electronics in order to significantly increase the power density of components and systems. This are also presentation around SiC and GaN, focused on achieving a technology breakthrough towards elevated operating temperature, extended lifetime of devices and smart digital controlled power conversion concepts for automotive and industry applications.
According to Professor Leo Lorenz, General Conference Director of the PCIM Europe, experts will “discuss achievements in power semiconductor devices based on [wide bandgap] WBG and silicon materials, pioneering research on passive components and key technologies for elevated operating temperature future device packages as well as new converter designs with minimised parasitic components and smart digital control concepts”.
Highlights of discussions planned include new materials for elevated operating temperatures with matched co-efficient of thermal extensions to increase lifetime on component and system level, application analysis of WBG devices compared with silicon devices in traction applications, considering single versus multi-level topologies, and smart digital control concepts for ultra-fast switching devices considering high dv/dt values and di/dt values for the overall system design.
The conference program will be complemented by user-oriented seminars on topics such as “Reliability Engineering in Power Electronics Systems”, a three-hour seminar held by Frede Blaabjerg, Francesco Iannuzzo and Huai Wang, from Aalborg University, Denmark.
The digital seminars will take place from 10 to 12 May.
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