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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Sonal Chandrasekharan, vice president of the Bluetooth product line at Infineon, explains that it has been “designed from the ground up with efficient peripheral design, low leakage silicon with scalable and efficient MIPS and a low power Bluetooth radio”. The RF performance provides reliable, robust connections, he adds.
The SoC integrates a power amplifier with 10dBm of transmit output power and has receive sensitivity of -98.5dBm for LE and -106dBm for LE-LR (low energy, low range) 125kbit/s, making it the best link budget in the AIROC Bluetooth portfolio.
The CYW20829 is the first Infineon AIROC Bluetooth SoC to use the Arm Cortex M33. The Bluetooth LE sub-system is characterised by low current consumption with an optimised radio and an Arm Cortex M33 core used as the Bluetooth controller. A second Arm Cortex M33 with a floating point unit is dedicated for customer applications and can be clocked up to 96 MHz to provide high performance compute at low power.
The application sub-system integrates configurable serial communication blocks that can be turned into UART, I2C or SPI as required. There are also multiple timer/counter pulse width modulators as well as I2S, PDM, CAN and LIN interfaces. There is a ROM based root of trust, a TRNG, eFuse for custom keys and cryptography acceleration for security. The SoC also supports XIP from external flash as well as encryption on the fly for content on the flash.
The AIROC CYW20829 is supported by ModusToolbox, a collection of development software and tools. The company’s online Developer Community has support for the AIROC Bluetooth and Multiprotocol SoC family and offers direct access to online applications support engineers.
The AIROC CYW20829 Bluetooth LE SoC is currently sampling to select customers.
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