Using the smaller, high-power density CFP15B instead of DPAK or SMB/C packages can save up to 60% of board space while maintaining electrical performance, explains the company. The rugged package design is also claimed to enable longer operating times and better board-level reliability. The package’s optimised lead form ensures uniform solder joints for improved automated optical inspection (AOI). CFP is particularly beneficial for

This rugged package design enables longer operating times and better board-level reliability. Its optimized lead form ensures uniform solder joints for improved automated optical inspection (AOI). A solution that particularly benefits modern ADAS, EV, LED lighting or ECU applications relying on advanced high-density designs.

The Schottky diodes and recovery rectifiers are housed in the CFP15B package and are available as standard and Q-types that meet AEC-Q101. The company has identified the market’s demand for accelerated transition to smaller, thermally optimised packages and claims to offer one of the most extensive CFP packaged diodes portfolios on the market from a single supplier.

The planar Schottky diodes have an operating range between 30 to 100V and 3.0 to 15A. The series includes versions optimised for low forward voltage (V_F) (e.g. the PMEG100V080ELPE/-Q) which deliver low conduction losses and high efficiency for cost-efficient DC/DC converters and in reverse polarity protection applications. Low leakage variants are also available with low reverse current and an operating temperature capability to offer robust performance against thermal runaway.

The eight 200V single-type recovery rectifier devices (the PNE200xxEPE/-Q series) have an average forward current (I_F) between 4.0 to 10A. The new devices complement Nexperia’s existing dual type recovery rectifiers.