The 80V and 100V ASFETs for hotswap are in a compact LFPAK88 package measuring 8.0 x 8.0mm and have an enhanced safe operating area (SOA), says the company. The ASFETs are optimised for demanding hotswap and soft-start applications. They are qualified to 175°C for use in advanced telecomms and computing equipment.  

Until now, ASFETs for hotswap and computing applications were limited to much bigger D2PAK packages (16 x 10 mm). LFPAK88 packages are the ideal replacement for D2PAK, providing up to 60% space efficiency, says the company.

The PSMN2R3-100SSE (100V, 2.3mΩ N-channel ASFET)  delivers low RDS(on) to meet the requirements of demanding hotswap applications. There second release is the PSMN1R9-100SSE (80V, 1.9mΩ), an 80V ASFET which has been developed for 48V power rails in computing servers and other industrial applications where environmental conditions allow for MOSFETs with a lower BVDS rating.

A third ASFET, the PSMN2R3-100SSE has an RDS(on) of only 2.3mΩ, representing at least a 40% reduction on currently available devices.  This improves power density improvements by a factor of 58 and the LFPAK88 offers two times higher ID (max) current rating together with low thermal and electrical resistance.

ASFETs with enhanced SOA have a strong linear mode performance to manage in-rush current effectively when capacitive loads are introduced to the live backplane. Low RDS(on) is also important to minimise I2R losses when the ASFET is fully turned on, adds Nexperia. This is the company’s third generation of enhanced SOA technology also achieves 10% SOA improvement compared to previous generations in D2PAK packages (33A vs 30A at 50V at 1ms).

The ASFETs have characterised SOA at both 25°C and 125°C. Fully tested, hot SOA curves are provided in the datasheets so design engineers do not have to perform thermal de-rating calculations. This also significantly extends the useful hot SOA performance, says the company.

Nexperia also offers a range of 25V, 30V, 80V and 100V ASFETs in a 5.0 x 6.0mm LFPAK56E package, optimised for lower power applications where a smaller PCB footprint is needed.

Visit Nexperia at PCIM Europe: Hall 9-317