The MLCCs have a reversed termination for low ESL. In addition to what is believes to be the industry’s first 0.18mm profile package, the footprint is just 0.5 x 1.0mm for 1µF capacitance.

They use Murata’s proprietary thin-layer forming and high precision lamination technology, advanced material atomisation and homogenisation techniques to achieve around a 20% reduction in component height compared with existing parts. The small form factor and dimensions allow the MLCC to fit on the reverse side of circuit boards. They can also allow for positioning amongst solder ball terminations, locating the parts in optimum positions for decoupling of processor power rails, close to the die. This allows fewer capacitors to be used, saving cost, and increasing system reliability, says Murata.

The LCC series has low ESR and reduced ESL which reduces the high frequency impedance of the capacitors and improves circuit performance for low voltage, compute-intensive applications, including ADAS (automotive advanced driver assistance systems).

The automotive-grade LLC series complies with AEC-Q200 requirements and passes the 1000 temperature cycle test and temperature/humidity endurance test of 85°C at 80 to 85% humidity for 1000 hours.