SiC power modules in a 32-pin, dual inline, moulded, through-hole package make up the ACEPACK DMT-32 family by STMicroelectronics.

The modules are available in a choice of four-pack, six-pack, and totem-pole configurations. According to ST, they provide high power density, a very compact design and provide simplified assembly. Targeted applications are on-board chargers, DC/DC converters, fluid pumps and air conditioning.

The modules contain 1200V SiC power switches that leverage ST’s second- and third-generation SiC MOSFET technology ensuring low R_DS(on) values, says the company. Efficient switching with minimal dependence on temperature contributes to efficient and reliable operation at converter system level.

The modules use the company’s robust ACEPACK technology to reduce overall system and design development costs. The package technology features a high-performance aluminium nitride (AlN) insulated substrate for thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.

The first product in ACEPACK DMT-32 is the M1F45M12W2-1LA with volume production expected Q4 2023.

Other members of the family, the M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production starting from Q1 2024.