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Power Electronics Europe News
New Energy-Saving DC-DC Converter ICs
ROHM has developed four new compact DC-DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz.
In recent years, increasing application functionality in consumer devices and industrial equipment is driving the demand to minimize board space, resulting in a rise in the adoption rate of compact DC-DC converter ICs.
Furthermore, as reducing standby power consumption is becoming a significant challenge, there is a growing need for DC-DC converter ICs to deliver higher efficiency during light load (low power) conditions. To meet these demands, ROHM developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products.
The new converter ICs deliver an output current of 1A to 3A in the compact TSOT23 package (2.8mm × 2.9mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9mm × 6.0mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance.
For more information visit: www.rohm.com
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In recent years, increasing application functionality in consumer devices and industrial equipment is driving the demand to minimize board space, resulting in a rise in the adoption rate of compact DC-DC converter ICs.
Furthermore, as reducing standby power consumption is becoming a significant challenge, there is a growing need for DC-DC converter ICs to deliver higher efficiency during light load (low power) conditions. To meet these demands, ROHM developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products.
The new converter ICs deliver an output current of 1A to 3A in the compact TSOT23 package (2.8mm × 2.9mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9mm × 6.0mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance.
For more information visit: www.rohm.com
View PDF
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