Features
Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
More details...
AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
Power Electronics Europe News
New industrial MOSFETs increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts. With the introduction of their Thin-TOLL 8x8 and TOLT packages, Infineon claims it is actively accelerating and supporting these trends by enabling a maximum utilisation of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account. The company is now expanding its portfolio of CoolSiC™ MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. Based on the CoolSiC Generation 2 (G2) technology, the perportedly offer significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances.
View PDF
The Thin-TOLL package has a form factor of 8x8 mm claining best-in-class Thermal Cycling on Board (TCoB) capability on the market. The TOLT package is a top-side cooled (TSC) enclosure with a similar form factor to TOLL. Both package types offer developers several benefits: Using them in AI and server power supply units (PSU), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8x8 package allows for a minimization of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling. In addition, TOLT devices complete Infineon's top-side cooled CoolSiC industrial portfolio, namely CoolSiC 750 V in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package.
For more information visit: www.infineon.com
For more information visit: www.infineon.com
View PDF
| Home / News / Features / Events / Media Data / Issue Archive / Magazine Subscription / Contact Us
| Privacy Policy | Site Map | © Copyright DFA Media
| Web design by Immersive Media
| Privacy Policy | Site Map | © Copyright DFA Media
| Web design by Immersive Media