Data centres are currently responsible for more than 2% of global energy consumption. Fuelled by AI, this number is expected to grow to up to around 7% in 2030, matching the current energy consumption of India.

Enabling efficient power conversion from grid-to-core is vital to enable superior power densities and thereby advance compute performance while reducing total cost of ownership (TCO).

Infineon Technologies has announced it has therefore launched the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centres.

The company says these modules enable true vertical power delivery (VPD) and offer industry's best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year.

“We are proud to enable high-performance AI data centres with our TDM2354xT and TDM2354xD VPD modules. These devices will maximise system performance with Infineon’s trademark quality and robustness, thereby enabling best TCO for data centres,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies.

“Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalisation and decarbonisation.”

Infineon says the TDM2354xD and TDM2354xT modules combine its robust OptiMOS 6 trench technology, a chip-embedded package that enables superior power density through enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery. As a result, the modules set new standards in power density and quality to maximise the compute performance and efficiency of AI data centres. The TDM2354xT modules support up to 160 A and are said to be the industry's first Trans-Inductor Voltage Regulator (TLVR) modules in a small 8 x 8 mm² form factor. Combined with Infineon's XDP controllers, they offer extremely fast transient response and minimise on-board output capacitance by up to 50%, further increasing system power density.

The new modules will be showcased at Infineon's global technology forum OktoberTech 2024 in Silicon Valley on 17 October and at electronica 2024 in Munich from November 12 to 14 (hall C3, booth 502).