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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Featuring increased power capability, lower power losses and compact device sizes, the company says this new portfolio is designed to meet high-growth market segments such as sustainability, E-Mobility and data centres. These high-performance IGBT 7 devices are said to be key building blocks for power applications in solar inverters, hydrogen ecosystems, commercial and agricultural vehicles and More Electric Aircraft (MEA).
Designers can select a suitable power solution based on their requirements. The IGBT 7 devices are offered in standard D3 and D4 62 mm packages, as well as SP6C, SP1F and SP6LI packages. Many configurations are available in the following topologies: three-level Neutral-Point Clamped (NPC), three-phase bridge, boost chopper, buck chopper, dual-common source, full-bridge, phase leg, single switch and T-type. Devices are available with voltages ranging from 1200V to 1700V and current ranging from 50A to 900A.
“The versatile IGBT 7 portfolio combines ease of use and cost efficiency with higher power density and reliability, offering our customers maximum flexibility. These products are designed for general industrial applications as well as specialised aerospace and defence applications,” said Leon Gross, Corporate Vice President of Microchip’s Discrete Product Group.
“Additionally, our power solutions can be integrated with Microchip’s broad range of FPGAs, microcontrollers (MCUs), microprocessors (MPUs), dsPiC Digital Signal Controllers (DSCs) and analogue devices to provide a comprehensive system solution from one supplier.”
Microchip says it offers a broad portfolio of power management solutions that includes analogue devices, Silicon (Si) and Silicon Carbide (SiC) power technologies, dsPIC Digital Signal Controllers (DCSs), and standard, modified and custom power modules.
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