MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The company says compared to competing devices in the same footprint, the Vishay Siliconix SiJK140E slashes on-resistance by 32% while offering 58% lower on-resistance than 40 V MOSFETs in the TO-263-7L.
With on-resistance down to 0.34 mΩ typical at 10 V, the recently released device is said to minimise power losses from conduction to increase efficiency while improving thermal performance with a low RthJC of 0.21 °C/W typical. By allowing designers to utilise one device instead of two in parallel to achieve the same low on-resistance, the SiJK140E can also improve reliability and mean time between failures (MTBF).
The MOSFET features a bond-wireless (BWL) design that minimises parasitic inductance while maximising current capability. While TO-263-7L solutions in bond-wired (BW) packages are limited to currents of 200 A, the SiJK140E offers a continuous drain current up to 795 A for increased power density while providing a robust SOA capability. Occupying an area of 120 mm2, the device’s PowerPAK 10x12 package saves 27 % PCB space compared to the TO-263-7L while offering a 50 % lower profile.
The SiJK140E is ideal for synchronous rectification, hot swap switching, and OR-ing functionality. Typical applications will include motor drive controls, power tools, welding equipment, plasma cutting machines, battery management systems, robotics, and 3D printers. To avoid shoot-through in these products, the standard-level FET offers a high threshold voltage of 2.4Vgs. RoHS-compliant and halogen-free, the MOSFET is 100 % Rg and UIS tested.
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