Features
Power_electronics Features

MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
More details...
AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
Power Electronics Europe News
 
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
ROHM has announced it has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTxSCZ40xxKTx), said to be ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.

The DOT-247 features a combined structure consisting of two TO-247 packages. The company says this design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an internal structure. Additionally, through optimised package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This can enable a power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in approximately half the volume.

The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.

To address this challenge, ROHM says it has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturisation compared to discrete components.

Evaluation boards will also be made available progressively to facilitate evaluation during application design. For more information, please contact a sales representative or visit the contact page on ROHM’s website.


 



View PDF
 
Go Back   
Newsletter sign up

Sponsors