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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The motion platforms are powered by EPC’s latest GaN power devices including the EPC33110 integrated three-phase ePower Stage IC for compact humanoid joint and drone propulsion control. The EPC23108/09 and EPC23110/11 integrated ePower Stage IC families support operation up to 100 V, with load current capability of 35 A (EPC23108, EPC23109) and 20 A (EPC23110, EPC23111), enabling reliable high-frequency switching performance. In the power-conversion stage, EPC will also highlight the EPC2366 40 V eGaN FET with ultra-low 0.84 mΩ RDS(on) specifically designed for synchronous rectifier applications on the secondary side of a 48 V-12 V LLC converter; and the EPC2361, 100V with typical Rds(on) of 0.75 mΩ. EPC2304 (200 V, 3.5 mΩ), EPC2305 (150 V, 2.2 mΩ) for high-power isolated DC-DC conversion, and the EPC2057 (50 V, 6 mΩ) for compact intermediate-bus regulation. EPC will also highlight the latest Gen7 products: EPC2370 (15 V, 0.28 mΩ), EPC2378 (25 V, 0.35 mΩ), and EPC2377 (40 V, 0.5 mΩ) in compact 3.3 × 3.3 mm dual-cool QFN packages, along with the EPC2375 (100 V, 0.9 mΩ) in a 3 × 5 mm dual-cool QFN. These devices deliver benchmark RDS(on) and low gate charge for high-efficiency, high-power-density modules and DC-DC power supplies used in AI data centers, robotics, and advanced motor-drive applications.
These devices are demonstrated on different platforms, shown at PCIM Europe, for development of humanoid robotics and drone propulsion. The EPC91122 and EPC91132 are motor drive reference designs based on the EPC33110. The EPC91122 will be demonstrated in both a large drone propulsion system and a robotic arm platform to demonstrate suitability for high torque, high power density motion architectures. A small drone propulsion system designed for lightweight, space-constrained applications with rapid dynamic response will also be showcased. Other motor-drive reference designs include EPC91121 (using the EPC2366), EPC91135 with the EPC2376 for higher-voltage 150 V inverter operation, EPC9186HCx with the EPC2361 for scalable high-current three-phase motor-drive architectures, and EPC91128/29/30/31 with the EPC231x Family which contain all the necessary critical functions circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense and protection functions.
High-density DC-DC conversion platforms include EPC91123, 6 kW, 800 V to 12.5 V Isolated Converter Evaluation Board; EPC91134, 11 kW, 400/800 Vdc to 50 Vdc Isolated Converter; EPC91107 (EPC2304), a 4-level totem-pole PFC delivering 12.5 A at 400 VDC; EPC90167, a half-bridge evaluation board for EPC2366, and EPC91109 (EPC2057), a compact two-phase synchronous buck converter supporting 20–36 V to 12/16/20 V conversion - demonstrating efficient front-end and intermediate-bus architectures for compact robotic and aerial power systems.
EPC will also show beyond robotics and drones, how GaN technology enables smaller and more efficient electrified platforms such as power tools and e-bikes where higher switching frequency and smaller system size directly translate into better performance, lighter weight and longer run time. Additionally, the company will demonstrate how the same GaN technology platform enables scalable, high-efficiency power conversion for emerging AI infrastructure, supporting the move to distributed power architectures and higher-density computing environments.
“PCIM Europe is the ideal platform to demonstrate how GaN is driving a new generation of intelligent motion and AI platforms,” said Alex Lidow, CEO and Co-Founder of EPC. “Engineers are embedding power electronics into moving and thinking structures, whether those are humanoid robots, drones or AI servers. Our Gen 7 GaN technology enables designers to reduce size and weight, while improving efficiency and reliability - critical requirements for scaling these systems from prototype to production deployments.”
EPC will also host special guest Mike Engelhardt, inventor of QSPICE, at its booth in Hall 9, Stand 304, where he will demonstrate how engineers can now simulate Efficient Power Conversion GaN discrete devices, half-bridges, and integrated circuits directly in QSPICE.
Visit EPC at PCIM Europe 2026 – Hall 9, Stand 304. For more information, please visit the PCIM Europe landing page.
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