The ACS724KMA (5V) and the ACS725KMA (3.3V) are available in a very small package for space-constrained applications, and also save cost through reduced board area, says the company. They are packaged in a high-isolation SOIC16 wide body surface mount package that provides reinforced isolation. The differential sensing technology provides immunity to interfering common mode magnetic fields from adjacent current traces or motors. Typical applications include motor control, load detection and management, switched-mode power supplies, and overcurrent fault protection.

A precise, low-offset, linear Hall sensor circuit with a copper conduction path located near the surface of the die allows applied current flowing through this copper conduction path to generate a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. The current is sensed differentially in order to reject common-mode fields, improving accuracy in magnetically noisy environments. 

The inherent device accuracy is optimised through the close proximity of the magnetic field to the Hall transducer, claims the company.  A precise, proportional voltage is provided by the low-offset, chopper-stabilised BiCMOS Hall IC, which includes the company’s patented digital temperature compensation. 

The output of the device has a positive slope when an increasing current flows through the primary copper conduction path (from pins one to four, to pins five to eight), which is the path used for current sensing. The internal resistance of this conductive path is 0.85 mΩ typical, providing low power loss.

The terminals of the conductive path are electrically isolated from the sensor leads (pins nine to 16). This allows the ACS724KMA current sensor IC to be used in high-side current sense applications without the use of high-side differential amplifiers or other costly isolation techniques.

Both ICs are provided in a low-profile surface-mount SOIC16 package. The leadframe is plated with 100% matt tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the device is Pb-free.