Features
Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
IPower 2013 - Building A Smart Power Future
Held at the University of Warwick, Coventry, UK, in conjunction with the University's Electronics, Power and Microsystems Research Group, the event will provide updates on power electronic developments, devices and technologies.
This year's theme is “Building A Smart Power Future". The two day event features a networking dinner and the opportunity to discuss technical solutions and practical problems to establish an infrastructure for a more cost effective, energy efficient future.
The conference will cover applications, trends and emerging markets; packaging, test and reliability; assembly materials and technologies; devices and integrated processes (micro-machining, micro-moulding); thermal management and efficiency; product design development and modelling; interconnection, integration and systems; solutions for harsh environments; high reliability and temperature, design and future concepts.
The schedule of 16 technical presentations provides opportunities for networking and time to review the poster displays and booths from exhibiting companies.
This year's theme is “Building A Smart Power Future". The two day event features a networking dinner and the opportunity to discuss technical solutions and practical problems to establish an infrastructure for a more cost effective, energy efficient future.
The conference will cover applications, trends and emerging markets; packaging, test and reliability; assembly materials and technologies; devices and integrated processes (micro-machining, micro-moulding); thermal management and efficiency; product design development and modelling; interconnection, integration and systems; solutions for harsh environments; high reliability and temperature, design and future concepts.
The schedule of 16 technical presentations provides opportunities for networking and time to review the poster displays and booths from exhibiting companies.
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