Features
MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
More details...
AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
Power Electronics Europe News
IPower 2013 - Building A Smart Power Future
Held at the University of Warwick, Coventry, UK, in conjunction with the University's Electronics, Power and Microsystems Research Group, the event will provide updates on power electronic developments, devices and technologies.
This year's theme is “Building A Smart Power Future". The two day event features a networking dinner and the opportunity to discuss technical solutions and practical problems to establish an infrastructure for a more cost effective, energy efficient future.
The conference will cover applications, trends and emerging markets; packaging, test and reliability; assembly materials and technologies; devices and integrated processes (micro-machining, micro-moulding); thermal management and efficiency; product design development and modelling; interconnection, integration and systems; solutions for harsh environments; high reliability and temperature, design and future concepts.
The schedule of 16 technical presentations provides opportunities for networking and time to review the poster displays and booths from exhibiting companies.
This year's theme is “Building A Smart Power Future". The two day event features a networking dinner and the opportunity to discuss technical solutions and practical problems to establish an infrastructure for a more cost effective, energy efficient future.
The conference will cover applications, trends and emerging markets; packaging, test and reliability; assembly materials and technologies; devices and integrated processes (micro-machining, micro-moulding); thermal management and efficiency; product design development and modelling; interconnection, integration and systems; solutions for harsh environments; high reliability and temperature, design and future concepts.
The schedule of 16 technical presentations provides opportunities for networking and time to review the poster displays and booths from exhibiting companies.
View PDF
| Home / News / Features / Events / Media Data / Issue Archive / Magazine Subscription / Contact Us
| Privacy Policy | Site Map | © Copyright DFA Media
| Web design by Immersive Media
| Privacy Policy | Site Map | © Copyright DFA Media
| Web design by Immersive Media