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The 3.0 and 5.0A modules contain 600V super-junction MOSFETs to maximise energy efficiency in compressors, fans, pumps, and other appliances. The 3.0A STIPQ3M60T-HL is offered in inline package and the STIPQ3M60T-HZ has zig-zag leads to save space and reduce pin separation. There are optional built-in slots for easy mounting of economical heatsinks, while separate open-emitter outputs ease PCB routing for single- or three-shunt current monitoring.

Each IPM contains a three-phase, half bridge comprising six MOSFETs, with gate drivers implemented as high-voltage ICs. For protection and fault prevention, additional integrated features include an uncommitted op-amp for current sensing, a comparator for high-speed fault protection, and an optional negative temperature co-efficient (NTC) thermistor for temperature monitoring. There is an integrated bootstrap diode to simplify board layout. Smart-shutdown circuitry protects the power switches, and under-voltage lockout (UVLO) prevents malfunction with low Vcc or Vboot.

The super-junction MOSFETs have low on-resistance, down to 1.0 or 1.6Ω (maximum) at 25°C, as well as low capacitances and gate charge to minimise both conduction and switching losses. This enhances efficiency in hard-switching circuits operating up to 20kHz, which includes a variety of industrial drives, and allows heatsink-free operation in low-power applications. Switching di/dt and dV/dt ensure low EMI, says the company, to simplify circuit design and layout.

The nano-IPMs are specified up to maximum operating junction temperature of 150°C and are UL 1557 recognised, providing up to 1500Vrms/min of isolation.