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Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
GaN transistor shrinks form factor compared with MOSFETs
![](http://79.170.40.53/power-mag.com/userfiles/image/PEE_JAN-2018/EPC_no text.jpg)
The eGaN FET has a voltage rating of 40V and maximum RDS(on) of 5mΩ with a 175A pulsed output current. According to the company, the chip-scale packaging handles thermal conditions better than the plastic packaged MOSFETs, as the heat is dissipated directly to the environment, whereas the heat from the MOSFET die is held within a plastic package.
The transistor measures just 2.5 x 1.5mm (3.75mm2). According to the company, the device marks the progress achieved by GaN transistor technology in terms of performance and cost reduction, particularly closing the gap between GaN and MOSFET technology.
The eGaN FET is available for immediate delivery from distributor Digi-Key.
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