Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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XPUs are graphics processor units (GPUs), central processing units (CPUs) and application specific integrated circuits (ASICs). The PoP MCMs multiply current and divide voltage from a 48V source in close proximity to XPUs to enable higher levels of XPU performance, claims the company. Power distribution efficiency and system density rise beyond the limitations of conventional 12V input multi-phase voltage regulators without current multiplication. PoP technology is for high current artificial intelligence (AI) processors and 48V autonomous driving systems.
PoP modules build upon Factorized Power Architecture (FPA) systems deployed in high performance computers and large scale data centres. FPA supports efficient power distribution and direct conversion from 48V to sub-1.0V XPUs.
Current multiplication can be deployed in close proximity to high current processors. For example, a pair of MCM4608S59Z01B5T00 (MCMs) and a MCD4609S60E59H0T00 modular current multiplier driver (MCD) provide 600A continuous and up to 1000A peak at up to 1.0V. The high density, low profile package (46 x 8 x 2.7mm) and low noise attributes make MCMs suitable for co-packaging within the XPU substrate or adjacent to it. Close proximity to the XPU eliminates substantial power loss and bandwidth limitations incurred in the so-called last inch of the current delivery path from the boundaries of 12V multi-phase regulators, says the company.
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