Features
Power_electronics Features

Comparing N-Channel and P-Channel MOSFETs: Which is best for your application?
This article compares the n-channel and p-channel power MOSFETs, introduces the complete Littelfuse p-channel power MOSFETs portfolio, and explores target applications.
More details...
AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
More details...
Power Electronics Europe News
 
Power ICs are now available in TO-Leadless packaging technology
The TO-Leadless package in combination with 40V shield-gate technology (SGT) is claimed to provide the highest current capability in its voltage class.  The TOLL package has the highest current capacity says the company, employing technology which uses a clip to achieve the 400A DC at 25°C capability. 

The TOLL packaging offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.

The AOTL66401 (40V) has a 30% smaller footprint compared to a TO-263 (D2PAK) package, and its higher current carry capability that enables the designer to reduce the number of devices in parallel. The device offers a higher power density and can be used for industrial BLDC motor applications and battery management to reduce the number of MOSFETs.

 

The AOTL66401 has a 0.7mΩ max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature. The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.

 

The AOTL66401 is immediately available in production quantities.

 

 



View PDF
 
Go Back   
Newsletter sign up

Sponsors