The TPSM53604 DC/DC buck module is supplied in a 5.5 x 5.5mm quad flat no-lead (QFN) package. According to the company, it enables engineers to shrink the size of their power supply by 30% while reducing power loss by 50% when compared to similar competing modules. The power module comes with a single thermal pad to optimise heat transfer, and to simplify board mounting and layout.

The buck module can operate in ambient temperatures up to 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport and aerospace and defence.

It can be paired with a compact step-down module such as the TPSM82813 and TPSM82810, to create a power solution from a 24V input down to the point of load, with minimum design time and effort.

The module has a total area of 85mm² for a small, single-sided layout for common 24V, 4A industrial applications in a standard QFN footprint.

The QFN package footprint also efficiently dissipates heat at high ambient temperatures as 42% of the package footprint touches the board, enabling more efficient heat transfer compared to competing BGA packages, claims the company. The module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90% at 24V to 5V.

The integrated high-frequency bypass capacitors and lack of bond wires help engineers meet the EMI standard defined by CISPR 11 Class B limits.

The TPSM53604 is available now, together with the TPSM53604 evaluation module.