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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The devices operate as both a high power receiver and a transmitter for rapid power transfer and power sharing with foreign object detection (FOD) and other proprietary safety IPs.
The company’s proprietary high-voltage technology is paired with mixed signal design and is intended for integration in a range of applications, such as wearable devices and small appliances to larger ones like smartphones and tablets. The IC is WPC Qi 1.2.4-compliant and compatible with all Qi-certified devices on the market.
The ICs have integrated low-impedance, high-voltage synchronous rectifier and low drop-out linear regulator for high efficiency and low power dissipation. These characteristics are critical for applications that are sensitive to unnecessary heat build-up, notes the company.
Firmware and platform parameters can be customised using an I2C interface. Configuration can be programmed into the embedded OTP while additional firmware patching is also available to enhance the IC’s application flexibility.
The company offers a selection of models in the family, from 5.0 to 20W. For lower power designs, there is the STWLC68JRH.
The STWLC68JRH is in production and available in a 3.29 x 3.7 x 0.6mm WLCPS 72-bumps 0.4mm pitch package.
Two evaluation-boards are also available. The STEVAL-ISB68RX is for standard 5.0W applications and the STEVAL-ISB68WA simplifies prototyping for PCBA-sensitive 2.5W low power applications. Both have header connectors for easy access to the GPIOs and other important signals. A USB dongle is included for configuring the device registers.
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