To meet the demand for fast switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters and wireless charging applications, the packaging technology can be used where high-power density and high efficiency in a small form factor is critical, says the company.

The packaging technology combines the KC-LINK proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s Transient Liquid Phase Sintering (TLPS) material to create a surface-mount, multi-chip capacitor, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor. The low-loss, low-inductance package is capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature, the company claims.

High mechanical robustness allows the capacitors to be mounted without the use of lead frames. The design provides low effective series inductance (ESL) and increases the operating frequency range.

Designed for an operating temperature range up to 150°C, the capacitosr can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling, for example within DC/DC converters in aerospace, medical and automotive applications.

The capacitors are available in commercial grade with tin termination finish and are Pb-free, RoHS- and REACH-compliant. The capacitors can be mounted in a low-loss orientation to increase their power handling capability further, adds the company.