The six-pack module is optimised for hybrid and small battery EVs, says the company. It combines its EDT2 IGBTs with package technologies that is says are proven for compactness, thermal management at reduced material cost and ease of installation.

EDT2 technology is an automotive micro-pattern trench field-stop cell design optimised for electric drivetrain applications. It offers a blocking voltage of 750V, a short-term extended operation temperature of 175°C and high short-circuit ruggedness. The light load power losses lead improve efficiency by 20% compared to the company’s IGBT3 technology.

The HybridPack DC6i has a compact footprint (72 x 140mm) which is the same as the HybridPack, and 25% smaller than the HybridPack Drive. The available output power is more than 50% higher. It has six screw connectors to the DC-link capacitor for a low-inductive design with a stray inductance of 15nH.

The patented direct-cooling wave baseplate provides cost-effective heat dissipation with a thermal resistance from the IGBT chip junction to the fluid of 0.17K/W.

The DC6i is designed for automated, high-volume production, featuring press-fit pins and additional guiding elements to enable gate driver board mounting in a few seconds; traditional selective soldering takes over one minute, notes the company.

The HybridPack DC6i is qualified to the AQG324 norm for automotive power modules and is in production now. It will be available from distributors in September 2020.