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Power_electronics Features

Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe Features
 
Power Converters View All
LATEST FEATURE: Obtaining Highest Efficiency in DC/DC Converter Applications - Nov 21 Read PDF
While improvements in Silicon power devices have been incremental, the introduction of wide-bandgap devices, such as Silicon Carbide (SiC), allow a jump in performance to be attained. Thanks to reference designs, such as Toshiba’s bidirectional DC/DC power supply, design engineers can significantly speed-up evaluation of suitable design approaches and topologies and get up to speed on the intricacies of using SiC...
Power Density View All
LATEST FEATURE: Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023 Read PDF
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
Power Diodes View All
LATEST FEATURE: Optimized High-Voltage Diodes - issue 6/2018 Read PDF
In the constant quest for smaller sizes, better performance and lower costs, Dean technology, Inc (DTI) has developed a new technology for producing high voltage diodes that enables the future of the product type without introducing new materials...
Power Factor Correction View All
LATEST FEATURE: Improving Efficiency and Power Factor at light load - issue 3/2016 Read PDF
Universal input AC/DC power supplies in the range of 80-800W can be found in a variety of applications. Within this power range, the single-stage boost PFC+ half-bridge LLC is considered to be a very popular topology....
Power Management View All
LATEST FEATURE: Integrated Battery-Charging Solution with Power Path Management - issue 5/2019 Read PDF
A new single coil power management IC with flexible configuration, rich functions and high efficiency integrates as many analog circuits as possible...
Power Modules View All
LATEST FEATURE: NewSpace demands low voltage, high current power for performance and longevity - Nov 2022 Read PDF
Matt Renola, Senior Director, Global Business Development – Aerospace & Defense
Power Packaging View All
LATEST FEATURE: A new standard in dual power MOSFET packaging - issue 3/2014 Read PDF
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
Power Reliability View All
LATEST FEATURE: How to define the adequate reliability requirement for a power electronic system? issue 1/2012 Read PDF
Relaibility is a key design factor for the vast majority of power electronic systems. Lifetimes of 20 years and more are often required for power applications, while lower failure rates during the useful life of a system are implicitly presumed..
Power Resistors View All
LATEST FEATURE: High-Power Resistors for demanding industrial applications - issue 4/2017 Read PDF
converters/inverters are core systems in industrial applications. Their continued development is driven by reduction of installation space and improved power/current quality...
Power Semiconductors View All
LATEST FEATURE: eGaN FETs enable more than 4 kW/in3 power density for 48 V to 12 V power conversion - March 2023 Read PDF
GaN transistors in Chip Scale Package (CSP) enable higher than 4 kW/in3 power density for 48V to 12V power conversion using an LLC resonant converter with up to 1 kW capability.
Power Supply Design View All
LATEST FEATURE: Novel GaN Design Reduces Volume of AC/DC Converters Substantially - May 2021 Read PDF
Power Integrations recently released a GaN-based IC called MinE-CAP, intended for use in a new generation of mobile credit card-sized chargers or offline power supplies. By halving the size of the high-voltage bulk electrolytic capacitors required in offline power supplies, this IC enables a reduction in adapter size of up to 40%. The device also reduces in-rush current making NTC thermistors unnecessary, increasing system efficiency and reducing heat dissipation.
Renewable Energies View All
LATEST FEATURE: The emerging role of preventative maintenance in wind turbines - issue 6/2014 Read PDF
In contrast to on-site staff at traditional power stations or the ready road access to transformer stations, wind turbines are generally unmanned and located in rural areas or in offshore wind farms....
Semiconductor Materials View All
LATEST FEATURE: Wolfspeed grows to meet supply challenge and launches high performance Gen 3+ die - March 2023 Read PDF
Silicon Carbide (SiC), known for long as the ideal semiconductor technology for power devices, has with design and manufacturing innovation not only increased its share of the existing market but enabled new applications, such as electric vehicles (EVs), by offering higher power density, better high-speed switching performance, higher breakdown field, higher thermal conductivity, higher chip temperatures and lower leakage currents than are possible with Silicon (Si).
Sensing Technologies View All
LATEST FEATURE: Solving the Current Sensor Footprint Problem when Designing Compact EV Traction Inverters - nov 2022 Read PDF
Electric vehicles (EVs) are said to be the future of transport as the trend for electric mobility moves forward. This article is focused on the challenges of current sensing in high-power integrated traction inverters and highlights the benefits of using compact magnetic core-based sensors. Sofiane Serbouh, Product Manager of Large Drives, LEM, Switzerland
Server Design View All
LATEST FEATURE: Elegant Hot-Swap Solution for server design - issue 4/2019 Read PDF
The need to implement protections and control circuits is a crucial design requirement in datacenter servers, telecom systems and networking equipment applications..
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