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Low power AFE extends lifetime of remote patient monitoring device

It is designed for use in small, battery-powered, continuously wearable devices. According to the company, this AFE on a chip offers clinical-grade vital sign measurements of bioimpedance analysis for patient health assessment for wellness wearables and medical-grade patches.

 

Many vital signs monitors, chest patches, stress monitors, bioimpedance (BioZ) and wearable healthcare devices must operate on a small battery to ensure small, compact designs that are convenient and comfortable for the user. The MAX30009 has a range of options to enable power optimisation according to the use case, ensuring it reduces the draw on tiny batteries to extend the operational life of wearable monitoring devices. It is claimed to reduce power consumption by 62% compared to the closest competitive product. As a result, it can be used for longer periods, extending measurement periods for body-worn patches and vital signs monitoring devices. The integrated AFE is also 30% smaller than the closest competitor, claims the company, allowing designers to reduce the size of vital signs measurement devices, making them more comfortable and convenient for patient healthcare devices as well as consumer devices.

 

Bioimpedance analysis devices are popular and convenient ways for healthcare professionals to measure body fat percentage and body composition (such as respiration and impedance cardiography.) The MAX30009 monitors a range of modalities through simultaneous I and Q measurements, two-electrode (bipolar) and four-electrode (tetrapolar) configurations. This enables flexible inputs for bioimpedance modality measurements as well as a range of sample rates from 16sps to 4ksps and a wide frequency range of 16Hz to 891kHz. Measuring respiration rate, galvanic skin response and electrodermal activity, body composition and fluid analysis, bioimpedance spectroscopy, impedance cardiography and plethysmography provides further insights into patient health.

The AFE is available now, in a 25-bump wafer level package (WLP) which measures 2.028 x 2.028mm. The MAX30009EVKIT# evaluation kit is also available now.



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