MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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It is designed to help meet the need for smaller, more reliable systems to extend driving range, using a distributed power architecture, where every isolated gate driver has a dedicated bias supply, where if one bias supply fails, the others remain operational, as do their paired gate drivers.
The UCC14240-Q1 has a small footprint and is just 3.55mm high to reduce the power module by as much as 50%, says TI. The low height gives engineers flexibility to place the module on either side of the PCB.
This dual-output power module offers 60% efficiency, which is twice that of traditional bias supplies, says TI. This doubles the power density and helps increase vehicle driving range. By delivering more than 1.5W at ambient temperatures of 105°C, the UCC14240-Q1 enables engineers to drive IGBTs, SiC and GaN switches at high frequencies.
The integrated transformer technology has a 3.5-pF primary-to-secondary capacitance, to allow the UCC14240-Q1 to mitigate EMI caused by high speed switching and to achieve common-mode transient immunity (CMTI) performance of more than 150V/ns. The module meets CISPR 25 and 32.
Other features are soft switching, spread-spectrum modulation, shielding and low parasitics. Fault monitoring, over-current protection, over-power and over-temperature protection are also integrated. An integrated closed-loop control enables ±1.0% accuracy from -40 to 150°C. The device’s tight tolerance enables the use of smaller power switches and are also claimed to improve over-current protection.
The UCC14240-Q1 offers third-party-certified 3kVrms isolation and is claimed to deliver the industry’s best vibration immunity.
The UCC14240-Q1 is available in pre-production quantities in a 36-pin, 12.8 x 10.3 x 3.55mm shrink small-outline package.
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