The company says Molex VaporConnect Optical Feedthrough Modules for two-phase immersion cooling address constant increases in data centre speed and capacity by leveraging a unique, cassette-based design that bolts directly onto immersion tanks and enables optical transceivers and network cabling infrastructure to be swapped out without changing mechanical interfaces or impacting immersion tank architecture. Reference designs for the new modules will be available commercially in Q1 of 2025.

“Molex continually embraces innovative optical solutions to ease data center deployments and upgrades while alleviating critical thermal management challenges,” said Trevor Smith, General Manager, Optical Connectivity, Molex. “VaporConnect gives customers the flexibility to upgrade connectivity and scale cooling system designs to keep pace with data center growth by simply deploying a different module, which will accelerate upgrades while reducing overall energy, cooling and technology costs.”

Streamlining Two-Phase Immersion Cooling

Molex VaporConnect Optical Feedthrough Modules simplify the connections between optical transceivers contained within immersion tanks and cabling infrastructure that exists outside the tank using fully upgradeable sealed modules. With VaporConnect, sealing and cabling is accomplished inside the module, giving customers the opportunity to upgrade connectors without impacting immersion tank design or architecture. Additionally, customers have the flexibility to re-use standard cabling infrastructure for multiple product generations, which further reduces deployment time, cost and complexity.

 A full range of industry-standard and Molex optical connector form factors are available for single- and multi-mode fibre solutions. They also feature mix-and-match functionality to facilitate system upgrades to newer or denser connectors. Customizable module footprints are available to fit specific space and application requirements.

Also, Molex VaporConnect Optical Feedthrough Modules are designed to minimise external patching and shuffle requirements by leveraging Molex FlexPlane optical circuitry technology. As a result, complex optical shuffles and high-density fibre routing are integrated seamlessly within the module for simpler installation and plug-and-play operation.

Reliable, Versatile, Upgradeable Optical Interconnects

A sealing gasket comes with every VaporConnect module, which is thoroughly tested using industry-standard, helium-leak testing to ensure a reliable seal with the tank wall. This also assures a seamless transition from the server line cards inside the tank to outside cabling infrastructure. Testing is underway for compliance with industry-standard GR-1435-CORE.

VaporConnect modules are designed to accommodate customer specifications, with the number of fibre channels dependent on the number and type of connectors used. As many as 576 fibres can be integrated into a single module. A range of form factor options are available, including MPO, LC and very small form factor (VSFF) options, such as MMC, MDC, SN and SN-MT. This ensures conformance to existing infrastructure and streamlines system upgrades. As part of Molex’s continued investment in this area, an EBO connector option is currently in development, with availability slated for the first half of 2025.

Commitment to Optical Network Innovations on Display at ECOC 2024

As one of  the largest manufacturer of Optical Feedthrough Modules for two-phase immersion cooling, Molex says it has shipped more than 350,000 optical channels to date. At this year’s ECOC’24, Molex says it will reinforce its commitment to optical network infrastructure innovations with on-site product displays, including the new VaporConnect Optical Feedthrough Modules. The company’s extensive line of optical connectivity products, optoelectronics solutions and wavelength management systems also are being featured at Stand C75. As a participating member in OIF, Molex is part of an interoperability demonstration, which takes place at Booth B83, to spotlight optical networking innovations and solutions for data centres, AI/ML technologies and disaggregated systems.