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Power Electronics Europe News
 
Valeo & ROHM Semiconductor co-develop the next generation of power electronics
Valeo, a leading automotive technology company, and ROHM Semiconductor, a major semiconductor and electronic component manufacturer, have announced they have collaborated to propose and optimise the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM says it will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack to Valeo for future powertrain solutions.  

Valeo says it is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (ebikes), through the mainstream (passenger cars) to the biggest one (eTrucks). By combining its expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo says it is driving the power electronics solution forward, contributing to the performance, efficiency, and decarbonisation of automotive systems worldwide.

Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchanges aimed at improving the performance and efficiency of the motor inverter – a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs). By refining power electronics, both companies say they aim to offer optimised cost/performance by delivering higher energy efficiency, reducing heat generation thanks to an optimised cooling and mechatronic integration, and increasing overall reliability with a SiC packaging.

"This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics," says Xavier Dupont, Valeo Power Division CEO. 

"Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”

“We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo,” says Wolfram Harnack, President ROHM Semiconductor.

These evolutions are all essential to supporting the growing demand for longer range, faster charging capabilities and, overall, a high performance and an affordable inverter for BEVs and PHEVs.

Valeo says it will start supplying a first series project in early 2026. Valeo and ROHM will contribute to the improvement of efficiency and downsizing of Valeo’s next generation of xEV inverters.

TRCDRIVE pack is a trademark for the SiC molded module developed for traction inverter drives. This product features high power density and a terminal configuration – solving the key challenges of traction inverters in terms of miniaturisation, higher efficiency, and fewer person-hours. Because SiC enables low-loss power conversion under high voltage conditions, combining Valeo's component technology, casing design and thermal management expertise with ROHM's power module creates a synergistic effect. Through both companies’ collaboration in automotive power electronics, they say they contribute to achieving a decarbonised society by enhancing the performance and efficiency of the motor inverter.




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