MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The single-channel IGBT and SiC-MOSFET driver ICs features the company’s FluxLink magneto-inductive bi-directional communication technology which ensures reinforced galvanic isolation between the primary and secondary sides. The coupling technology permits data transfer with galvanic isolation and includes a minimum internal 0.4mm separation between the low- and high-voltage sides. It therefore eliminates the need for opto-electronics, which suffer parametric changes with age and thermal degradation that limits operational lifetime. Magnetically-coupled conductors are locked into a homogenous thermoset, which together with the insulation enhances operational stability and longevity. The ICs use the company’s robust eSOP package, which offers a CTI level of 600, 9.5mm creepage and clearance distance, and easily meets automotive 5500m altitude requirements.
The IC can be used for EV and HEV applications including the main inverter, brake chopper, DC/DC battery converter and AC/DC onboard battery-charger designs. AEC-Q100 approval allows the gate driver family to be used in automotive design to increase system efficiency and provide safe, reliable isolation.
Using the ICs can reduce the bill of materials and simplifies the automotive DC/DC converter for the secondary-side supply voltage as only a unipolar voltage is required by the Scale-iDriver IC. Built-in voltage and power management circuitry is accompanied by safety features including advanced soft shut down (ASSD) for short-circuit turn-off and under-voltage protection.
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