BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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The company integrates the new StrongIRFET™ 2 MOSFETs from Infineon into its product portfolio. The new generation claims to impress with its higher power efficiency, which leads to improved overall system performance. Due to a higher current load tolerance, several parallel connected components are no longer necessary. That saves space on the PCB and reduces costs.
Compared to the previous StrongIRFET™ components in the 40 V to 100 V range, the new technology potentially offers up to 40 percent better on-resistance (RDS(on)) and up to 60 percent lower nominal gate charge (Qg). In addition, higher rated currents enable improved current carrying capacity and the new generation is suitable for both high and low switching frequencies.
Standard pinouts enable simple drop-in replacement. The MOSFETs are 100 percent safety-tested, RoHS-compliant, halogen-free following IEC61249-2-21 product validation, and meet the JEDEC standard. Thanks to their characteristics, they are predestined for a wide range of applications, e.g. for UPS, battery management, or motor drives.
More features at a glance:
- Excellent price/performance ratio
- Industry-standard footprint through-hole package
- Right-fit and robust
Examples of applications in the automotive industry:
- Power Management (SMPS)
- Adapter
- Motor drives
- Battery powered applications
- Battery management
- UPS
- Light electric vehicles
For more information visit: www.rutronik.com
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