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Edge Computing Leverages Modular Power in Scalable Micro Data Centres - May 2022
Edge computing is essential to realizing the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of...
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Power Electronics Europe News
 
The integration of discrete power semiconductors and drivers in one package allows designers to reduce time to market, says the company. The module is optimised for three-phase inverters up to 1.2kW and an operating range of 1.0 to 20kHz.

The IM323-L6G IPM uses 600V TrenchStop RC-D2 technology with monolithically integrated diode delivering a maximum junction temperature of 175 ºC for the switch. The rugged C5SOI gate driver technology is optimised for negative voltage spikes at the motor outputs to ensure a short-circuit capability of at least 3µs, says the company. In case of overcurrent and under voltage, the IPM provides cross-conduction prevention and all switches turned off in the event of over-current or under-voltage.

The IM323-L6G is moulded in a robust and pin-compatible 33 x 19mm DIP with built-in NTC (negative temperature co-efficient) which allows a high degree of flexibility in terms of the mechanical system design, says Infineon. It is also claimed to offer improved package robustness, for high reliability.

The IM323-L6G and iMotion Modular Application Design Kit (MADK) can be ordered now. The CIPOS Tiny IM323 product range is planned to be expanded by the end of 2022 to include 6A and 10A variants.

Visit Infineon at PCIM 2022: Hall 7- 412 and Hall 9 - 305



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