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NewSpace demands low voltage, high current power for performance and longevity - Nov 2022
Matt Renola, Senior Director, Global Business Development – Aerospace & Defense
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Power Electronics Europe News
Murata collaborates with NXP for Wi-Fi 6 and Bluetooth 5.3 module
The module uses proprietary packaging and miniaturisation technologies, resulting in a module size of 19.1 x 16.5 x 2.1mm. The Type 1XL is small enough to integrate in to size- and power-sensitive electronic devices for IoT, smart home, audio/video/voice, smart TV, and gateway applications and bring IoT (internet of things) to the mass market, says the company.

The Wi-Fi 6 and Bluetooth 5.3 module is based on the NXP 88W9098 combo chipset. The small, dual-band module supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy. The Wi-Fi section supports connectivity up to 1.4 times faster than conventional Wi-Fi compatible devices, claims the company, offering data rates of up to 1200Mbit/s. It  also supports the PCIe 3.0 interface with optional support for SDIO 3.0.

The Bluetooth 5.3 LE section supports speeds of up to 2Mbit/s with a high speed four-wire UART interface, optional support for SDIO and PCM for audio data.

According to Murata’s manager of the IoT Module department, Akira Sasaki, the module enables high speed communication to improve quality and meet the demands on the wireless communication bandwidth with increasing streamed content, such as 4K/8K video, together with increases in traffic due to teleworking and remote video conference calls.

The Type 1XL module uses hardware mechanisms and algorithms to optimise Wi-Fi and Bluetooth co-existence for maximum performance.

It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.

The Type 1XL module is now in mass production.

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