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Edge Computing Leverages Modular Power in Scalable Micro Data Centres - May 2022
Edge computing is essential to realizing the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of...
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Power Electronics Europe News
 

The economical modules are packaged in the industry standard full-brick form factor, and offer high useable power and a robust design suitable for the demands of distributed power architectures, says the company. Applications include data communications, telecommunications, and test and measurement equipment.

 

The PCB mounted, industry standard, full-brick footprint measure 116.84 x 60.96 x 13.21mm. The integral baseplate allows the 12V model to operate at 500W in an ambient temperature of 52°C, with just 2m/s airflow. The use of an external heatsink or cold plate further extends the thermal performance, adds the company. Efficiencies are up to 94%, to reduce internal power losses.

 

Two output voltages are available, for driving point of load (PoL) converters. The 12V 50A model has a wide 7.2 to 13.2V adjustment range; the 9.6V 58A version can be set between 5.76 and 10.56V. Both models accept a 36 to 75V DC input and can operate in temperatures of -40C to 125°C. Output trim and remote sense are provided as standard.

Input to output and input to baseplate isolation is 1,500V DC, with an output to baseplate isolation of 500V DC.

 

Safety certification includes IEC/EN 60950-1, UL/CSA 60950-1 with CE marking for the Low Voltage and RoHS2 Directives.

 

 



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